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Longji releases new component packaging technology
Release time£º2019-07-30 Read£º488
Recently, Longji announced that it has developed a "seamless welding" technology that can completely eliminate the gap between the components in the module and improve the efficiency of the module. It is planned to be introduced into mass production in the second half of 2019. After TÜV Nande's test on May 30, 2019, Longji combined the technology of “seamless soldering” and innovative component design to push the front power record of the double-sided PERC component to 500.5W.
The “seamless soldering” technology uses a solder ribbon to achieve “tile” interconnection of the cell, completely eliminating the cell gap of 2mm wide, improving efficiency while reducing the BOM cost of the component. This technology is perfectly compatible with existing component processes and equipment. It has a very high mass production maturity and stability, and it is convenient to upgrade the capacity. In addition, "seamless soldering" can integrate M6 single crystal silicon wafer, thin silicon wafer, fine wire or reflective solder ribbon technology, and has good technical compatibility.
High efficiency and high power are the continuous pursuits in the evolution of photovoltaic module technology and are the key factors to reduce the cost of photovoltaic power. It is understood that Longji has carried out intellectual property layout around “seamless welding” technology and applied for a number of patents. The launch of this technology marks a new step in the technical strength of Longji's components. Longji will continue to invest in technology to promote the application of photovoltaics in a wider range of the world.
The “seamless soldering” technology uses a solder ribbon to achieve “tile” interconnection of the cell, completely eliminating the cell gap of 2mm wide, improving efficiency while reducing the BOM cost of the component. This technology is perfectly compatible with existing component processes and equipment. It has a very high mass production maturity and stability, and it is convenient to upgrade the capacity. In addition, "seamless soldering" can integrate M6 single crystal silicon wafer, thin silicon wafer, fine wire or reflective solder ribbon technology, and has good technical compatibility.
High efficiency and high power are the continuous pursuits in the evolution of photovoltaic module technology and are the key factors to reduce the cost of photovoltaic power. It is understood that Longji has carried out intellectual property layout around “seamless welding” technology and applied for a number of patents. The launch of this technology marks a new step in the technical strength of Longji's components. Longji will continue to invest in technology to promote the application of photovoltaics in a wider range of the world.
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